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Security: In the drawing process, the role of the die is drawn at the drawing force unit area on the wire cross-sectional drawing stress σ1. To make the metal mold plastic deformation in the hole, drawing stress σ1 must be greater than the deformation resistance σT mold hole in the metal deformation zone; and in order to prevent the wire out of the die hole and continue deformation attenuated or pull off thereby destabilizing drawing process, drawing stress σ1 must be less than the die hole after the wire is drawn yield limit σs, and therefore for achieving the drawing process is usually expressed as: σT

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